제품소개

  • 수직연속 동도금 장치
  • 전자동  전기동 도금장치
  • 전자동 무전해 Ni-Au 도금장치
  • 전자동 화학동 도금장치
  • 전자동 전해 NI-Au 도금장치
  • Black Oxide Line
  • Desmear Line
  • 건욕장치
  • 정류기
Product Introduction Desmear Line

Desmear Line

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Desmear Line
- Carrier Type
In PCB manufacturing process, epoxy on the inner wall of hole is attached to the inner hole due to heat created by a rapid rotation of drill. This equipment is used to remove the smear attached to the inner wall of hole by melting it with permanganate.
Desmear Line Process

Specifications
CAPA
10,000㎡/month 20,000㎡/month 30,000㎡/month
Plating thickness
To be consulted upon request
PCB thickness
L 340~610mm H 340~610mm