제품소개

  • 수직연속 동도금 장치
  • 전자동  전기동 도금장치
  • 전자동 무전해 Ni-Au 도금장치
  • 전자동 화학동 도금장치
  • 전자동 전해 NI-Au 도금장치
  • Black Oxide Line
  • Desmear Line
  • 건욕장치
  • 정류기
Product Introduction Black Oxide Line

Black Oxide Line

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Black Oxide Line
Carrier Type
This equipment is used to reinforce adhesion of circuit surface in laminating process of copper foil circuit (Cu) layer and insulation layer of inner layer and in oxidizing and gluing the circuit surface formed within the inner layer to the prepreg.
Black Oxid Line Process

Specifications
CAPA
10,000㎡/month 20,000㎡/month 30,000㎡/month
Plating thickness
To be consulted upon request
PCB thickness
L 340~610mm H 340~610mm