제품소개

  • 수직연속 동도금 장치
  • 전자동  전기동 도금장치
  • 전자동 무전해 Ni-Au 도금장치
  • 전자동 화학동 도금장치
  • 전자동 전해 NI-Au 도금장치
  • Black Oxide Line
  • Desmear Line
  • 건욕장치
  • 정류기
Product Introduction Fully automated electrolytic Ni-Au plating equipment

Fully automated electrolytic Ni-Au plating equipment

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Fully automated electrolytic Ni-Au plating equipment
Carrier Type (Hard Gold, Soft Gold)
This equipment is used in the PCB manufacturing process to enhance the adhesive strength by maximizing bonding through electrical plating of Ni-plating and Au-plating on the copper foil surface after applying solder resist for the purpose of enhancing electrical reliability.
Process

Specifications
CAPA
3,000㎡/month ~ 30,000㎡/month
Plating thickness
To be consulted upon request
PCB thickness
L 340~600mm H 340~500mm