제품소개

  • 수직연속 동도금 장치
  • 전자동  전기동 도금장치
  • 전자동 무전해 Ni-Au 도금장치
  • 전자동 화학동 도금장치
  • 전자동 전해 NI-Au 도금장치
  • Black Oxide Line
  • Desmear Line
  • 건욕장치
  • 정류기
Product Introduction Fully automated chemical copper plating equipmen

Fully automated chemical copper plating equipmen

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Fully automated chemical copper plating equipmen
(Carrier Type)
The conductor layer within the hole created by drilling in the PCB process is separated from the insulation layer. This equipment conducts electricity between these layers and is used for chemical Cu plating process.
Process

Specifications
CAPA
10,000㎡/month ~ 20,000㎡/month
30,000㎡/month
Plating thickness
To be consulted upon request
PCB thickness
L 430~600mm H 340~500mm