Product Introduction
Fully automated chemical copper plating equipmen
- Fully automated chemical copper plating equipmen(Carrier Type)
- The conductor layer within the hole created by drilling in the PCB process is separated from the insulation layer. This equipment conducts electricity between these layers and is used for chemical Cu plating process.
Process

Specifications
- CAPA
- 10,000㎡/month ~ 20,000㎡/month30,000㎡/month
- Plating thickness
- To be consulted upon request
- PCB thickness
- L 430~600mm H 340~500mm