Fully automated chemical copper plating equipmen
(Carrier Type)

The conductor layer within the hole created by drilling in the PCB process is separated from the insulation layer. This equipment conducts electricity between these layers and is used for chemical Cu plating process.

Process

Specifications

CAPA

10,000㎡/month ~ 20,000㎡/month
30,000㎡/month

Plating thickness

To be consulted upon request

PCB thickness

L 430~600mm H 340~500mm