제품소개

  • 수직연속 동도금 장치
  • 전자동  전기동 도금장치
  • 전자동 무전해 Ni-Au 도금장치
  • 전자동 화학동 도금장치
  • 전자동 전해 NI-Au 도금장치
  • Black Oxide Line
  • Desmear Line
  • 건욕장치
  • 정류기
Product Introduction Fully automated electroless Ni-Au plating equipment

Fully automated electroless Ni-Au plating equipment

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Fully automated electroless Ni-Au plating equipment
Carrier Type (ENIG, ENEPIG)
This equipment is intended to perform chemical treatment on the pad surface (Ni + Au plating) where parts are to be mounted for the purpose of preventing circuit surface (Cu surface) from being oxidized and promoting durability against abrasion, heat-resistance, corrosion-resistance and conductivity.
ENIG Process

ENEPIG Process

Specifications
CAPA
10,000㎡/month ~ 20,000㎡/month
Plating thickness
To be consulted upon request
PCB thickness
L 250~510mm H 360~610mm