제품소개

  • 수직연속 동도금 장치
  • 전자동  전기동 도금장치
  • 전자동 무전해 Ni-Au 도금장치
  • 전자동 화학동 도금장치
  • 전자동 전해 NI-Au 도금장치
  • Black Oxide Line
  • Desmear Line
  • 건욕장치
  • 정류기
Product Introduction Fully automated electrolytic plating equipment

Fully automated electrolytic plating equipment

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Fully automated electrolytic plating equipment
Carrier Type (P/N , P/T)
This equipment is intended to electrically connect layers of PCB holes (PTH or BVH) created by drilling through copper plating
In general, we perform electroless copper plating on the inner wall and surface of hole exposed in drilling and then electrolytic copper plating to establish a desired thickness of circuit.
Pattern Process

Panel Process

Specifications
CAPA
6,000㎡/month ~ 20,000㎡/month
Plating thickness
To be consulted upon request
PCB thickness
L 400~510mm H 450~610mm
Accessories
  • Feed-discharge
    Manual loading / unloading
  • Plating thickness
    • P/N : 10~30㎛
    • P/T : 10~30㎛
  • Applicable Hole Type
    IVH, PTH, BVH, and SVH (Stack Via Hole)
  • Others
    • Liquid chemical feeder available
    • Air blower installed for a proper mixture of PCB and chemical
    • Able to feed Anode Ball while the equipment is in operation. (Anode Ball feeder installable)
    • PC control and log management system available