제품소개

  • 수직연속 동도금 장치
  • 전자동  전기동 도금장치
  • 전자동 무전해 Ni-Au 도금장치
  • 전자동 화학동 도금장치
  • 전자동 전해 NI-Au 도금장치
  • Black Oxide Line
  • Desmear Line
  • 건욕장치
  • 정류기
Product Introduction Vertical Continuous Copper Plating Equipment

Vertical Continuous Copper Plating Equipment

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Vertical Continuous Copper Plating Equipment
( PAL-MCP )
This equipment is designed to perform electric plating with copper (Cu) that conducts electricity on PCBs in desired thickness to create a hole on the PCB following the chemical plating process.
MCP Process

Specifications
CAPA
10,000㎡/month ~ 20,000㎡/month
Plating thickness
To be consulted upon request
PCB thickness
L 250~400mm H 300~500mm
Accessories
  • Feed-discharge
    Fully automated (able to streamline the process ranging from feeding, to washing and discharging)
  • plating thickness
    10~30㎛ (configurable)
  • Applicable Hole Type
    IVH, PTH, BVH, and SVH (Stack Via Hole)
  • Others
    • Equipment cover installable
    • Liquid chemical feeder available
    • PC control and log management system available
    • Able to feed Anode Ball while the equipment is in operation.